Re: What is the Best PCB Layout software ? (Money no object)
From: Ralph Malph (noone_at_yahoo.com)
Date: 01/13/04
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Date: Mon, 12 Jan 2004 23:48:21 -0500
Ian McBride wrote:
>
> "Ralph Malph" <noone@yahoo.com> wrote in message
> news:40036859.F8EA05E7@yahoo.com...
>
> > One thing it can't do (without screwing up the DRC) is holes in a PAD.
> > I am using a small regulator that requires heat spreaders on the top and
> > bottom of the board connected by vias directly under the thermal pad on
> > the bottom of the package. I know this is not normal, but TI recommends
> > it. I was never able to get rid of the DRC errors this produced.
>
> If this is the package I remember, you can make the thermal pad a small pad
> with THERMAL=OFF inside a rectangle on the top layer. A pain, but no DRC
> complaints.
I am not trying to make a thermal. I am trying to make a fairly large
rectangular pad with six holes (vias) in it. The entire rectangle needs
to have the solder mask removed from it. I guess I could have split the
pad up into six equal, rectangular areas as pads. But they should be
touching and I don't think I can get this past the DRC either unless I
allow everything to touch. I believe I have object spacing set for 10
mil at the moment.
Or could I use a polygon to open up an area in the solder mask? I did
not try much in that area.
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