Re: bake the IC before mounting?
From: Rich Webb (bbew.ar_at_mapson.nozirev.ten)
Date: 01/29/05
- Next message: Steve at fivetrees: "Re: C vs C++ in Embedded Systems?"
- Previous message: Steve at fivetrees: "Re: C vs C++ in Embedded Systems?"
- In reply to: vax, 9000: "bake the IC before mounting?"
- Next in thread: David Powell: "Re: bake the IC before mounting?"
- Messages sorted by: [ date ] [ thread ] [ subject ] [ author ]
Date: Sat, 29 Jan 2005 04:47:17 GMT
On Fri, 28 Jan 2005 22:52:21 -0500, "vax, 9000" <vax9000@gmail.com>
wrote:
>I bought some AM186 and AM188 IC's. The caution note on the bag says if I
>use infered or vaper-phase reflow, after I open the bag, I need to install
>the IC's in 168 hours, if I don't store them in places with relative
>humidity of <20% after opening. Otherwise I need to bake them (192 hours at
>40C and 5% or 24 hours at 125C). I think this requirement is hard to
>understand. If they are not wet, I can't see how a little bit humidity
>would distroy them when I reflow them in the oven. Can somebody enlighten
>me? Thank you.
Google for the terms "popcorn reflow humidity" or similar for some
lengthy explanations and a few nice pictures.
-- Rich Webb Norfolk, VA
- Next message: Steve at fivetrees: "Re: C vs C++ in Embedded Systems?"
- Previous message: Steve at fivetrees: "Re: C vs C++ in Embedded Systems?"
- In reply to: vax, 9000: "bake the IC before mounting?"
- Next in thread: David Powell: "Re: bake the IC before mounting?"
- Messages sorted by: [ date ] [ thread ] [ subject ] [ author ]