Re: Recommendation for prototype CM (BGA reflow, mainly)
- From: "linnix" <me@xxxxxxxxxxxxxxxxxx>
- Date: 30 Sep 2005 12:30:07 -0700
larwe wrote:
> > > at a reasonable price, reflow these BGA parts onto a PCB for me. I
> > > don't want anything else stuffed, just this one part, since I need to
> >
> > Tin-foil, a heat-gun and a sacrificial apprentice :-p
Just a steel plate with 25mm x 25mm square hole. I am thinking about
the same. Unfortunately, mime is 35mm x 35mm; otherwise, we could
share the stencil.
>
> I don't even need the tinfoil for this, as there are no other parts on
> the board - however my success rate with this method has been <50% and
> these chips are $30 each (the PCBs are $175 each). I really want them
That's expensive, even if you have 10 layers. Are you counting setup
costs?
> to be mounted by someone with a better yield :). Anything up to about
> $100 per board is, statistically, good value!
>
> > I've used Invotech for low volume production runs and they were mostly OK
> > with BGA and are a lot better now (I think we were used as guinea pigs.) If
> > you talk about approx 1K volumes you might be able to wangle two or three
> > development boards for free to prove their processes.
>
> I'll check them out, however I don't want to lie to anyone - the 1K is
> very much a maybe.
By the way, in productions, would you be mounting the BGA first, or
last? I am thinking about mount it last, but the stencils are more
tricky to make.
.
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