Re: Multi-processor breadboard: CAD files are up

On Apr 30, 9:00 am, larwe <zwsdot...@xxxxxxxxx> wrote:
linnix wrote:
18V, so we would need chip L & C. Our current plan is a DIP-32 multi-
chip module. I can't ask you for commitment, just my suggestion.

Why would anyone need a specialized protoboard for a part that's in
DIP packaging?

They would need it to evaluate uC and components,
without spending too much time making the board first.

Let me tell you the story.
I hope it won't get back to the customer,
since I still have to work with them.

They picked the Accelerometer.
Build the PCB, Made the custom LCD.
Plastic injected the case. Spent lots of money.

Now, we are taking to their CEO that the accelerometer won't cut it.
So, we are back to square one. I can tell you that the Engineers
who did not evaluate the sensor carefully will have other jobs.

.